Description

• Technical service engineer who provides technical engineering support for Henkel’s Advanced Packaging Material products and responsible for developing in depth application knowledge for Henkel Adhesive Electronics markets
• Primary responsibilities are technical leading on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problem
• She/he ensures that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
• Solves technology-specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.

Requirements

• Minimum of a Bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields, with 10+ years of experience working in a chemical for semiconductor advanced packaging environment.
• Good understanding for the latest Semiconductor Packaging trend.
• Further knowledge of statistical analysis and design of experiment (DOE) is needed.
• Have strong verbal communication skills one-on-one with colleagues/customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi-task assignments
• Strong ownership and responsibility with customer-oriented mindset and good understanding of customer request & culture
• Effective in using project and time management skills to drive projects to completion and focusing on commitment to deliver the highest level of quality work consistently
• Has ability to successfully handle on-sight support of complex customer issues.
• Successfully self-directs project work.
• Ability to formulate strong conclusions & path forward from project work.